ICPT background

CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.

ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.

• Conference chair

  Taesung Kim  Sungkyunkwan Univ.

• Program chair

  Youngki Ahn  Daelim Univ.
  Kwangsu Kim  Daelim Univ.

• Conference secretary

  Cheolmin Shin  Sungkyunkwan Univ.
  Seokjun Hong   Sungkyunkwan Univ.

• Local Organizing Committee

  Seungki Chae	Sungkyunkwan Univ.	Hyeongjae Kim	KITECH
  Wonhee Lee	Dow Chemical	Woowon Jeong	Shinhan Diamond
  Changki Hong	Versum Materials Korea	Chanki Yang	Ehwa Diamond
  Chieon Oh	RTCK	Youngjung Kim	FUJIMI KOREA
  Jueyoung Lee	EBARA	Geonja Lim	BASF
  Kwangho Oh	Saesol Diamond	Chuljin Park	Ace Nanochem
  Byeongju Min	KPX Chemical	Jongwoo Kim	SKC
  Jichul Yang	SK Hynix	Younjin Cho	Samsung SDI
  Euihoon Jung	KCTECH	Sanghyeon Park	3M
  Hyeonseop Lee	Dongmyung Univ.	Uirae Kim	ECI Technology
  Heejun Yang	Entegris