CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.
ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.
Local Organizing Committee
Seungki Chae Sungkyunkwan Univ. Hyeongjae Kim KITECH Jaedeok Kim Cabot Korea Heejun Yang Entegris Wonhee Lee Dow Chemical Woowon Jeong Shinhan Diamond Changki Hong Versum Materials Korea Chanki Yang Ehwa Diamond Chieon Oh RTCK Youngjung Kim FUJIMI KOREA Jueyoung Lee EBARA Geonja Lim BASF Kwangho Oh Saesol Diamond Chuljin Park Ace Nanochem Byeongju Min KPX Chemical Jongwoo Kim SKC Jichul Yang SK Hynix Younjin Cho Samsung SDI Euihoon Jung KCTECH Sanghyeon Park 3M Hyeonseop Lee Dongmyung Univ. Taesung Kim Sungkyunkwan Univ. Youngki Ahn Daelim Univ. Cheolmin Shin Sungkyunkwan Univ. Seokjun Hong Sungkyunkwan Univ.