ICPT 2018

Conference Information
본문 헤드밑 언더라인

ICPT background

CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.

ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.

  • Conference chair

    Taesung Kim  Sungkyunkwan Univ.

  • Program chair

    Youngki Ahn  Daelim Univ.

  • Conference secretary

    Cheolmin Shin  Sungkyunkwan Univ.
    Seokjun Hong   Sungkyunkwan Univ.

  • Local Organizing Committee

    Seungki Chae Sungkyunkwan Univ. Hyeongjae Kim KITECH
    Jaedeok Kim Cabot Korea Heejun Yang Entegris
    Wonhee Lee Dow Chemical Woowon Jeong Shinhan Diamond
    Changki Hong Versum Materials Korea Chanki Yang Ehwa Diamond
    Chieon Oh RTCK Youngjung Kim FUJIMI KOREA
    Jueyoung Lee EBARA Geonja Lim BASF
    Kwangho Oh Saesol Diamond Chuljin Park Ace Nanochem
    Byeongju Min KPX Chemical Jongwoo Kim SKC
    Jichul Yang SK Hynix Younjin Cho Samsung SDI
    Euihoon Jung KCTECH Sanghyeon Park 3M
    Hyeonseop Lee Dongmyung Univ. Uirae Kim ECI Technology

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Manager : Kyunghwan Jung | TEL : +82-31-374-1582 | E-mail : icpt2018@nate.com | Company Registration No. : 241-19-00428

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