ICPT 2018

Committees
본문 헤드밑 언더라인
  • International Executive Committee

    Korea Jin-Goo Park, Hanyang University
    Haedo Jeong, Pusan National University China Xinchun Lu, Tsinghua University
    Xinping Qu, Fudan University Europe Gerfried Zwicker, Fraunhofer ISIT
    Viorel Balan, CEA-LETI, France Taiwan Chris Chern, TSMC
    Willie Pai, Kinik Company United States Paul Feeney, Independent consultant
    Robert Rhoades, Entrepix Japan Syuhei Kurokawa, Kyushu University
    Yukiteru Matsui, Toshiba Memory Corporation

  • International Program Committee

    Korea Kwangsu Kim, Daelim Univ.
    Jonghan Shin, SK Hynix Semiconductor
    Yungjun Kim, Samsung Electronics
    China Shumin Wang, Anji Microelectronics
    Baoguo Zhang, Hebei University of Technology
    Weili Liu, Shanghai Xinanna Electronic Technology
    Kun Li, Tianjin Hwatsing Technology Europe Knut Gottfried, Fraunhofer ENAS, Germany
    Eric Jacquinot, Merck Performance Materials, France
    Patrick Ong, IMEC, Belgium
    Cedric Perrot, STMicroelectronics, Crolles, France Japan Michio Uneda, Kanazawa Institute of Technology
    Kazumi Sugai, Fujimi Inc.
    Norikazu Suzuki, Nagoya University
    Yasuhisa Sano, Osaka University Taiwan KC Wu, Cabot Microelectronics
    Tengchun Tsai, TSMC
    Daniel Fang, National Taiwan University of Science and Technology
    Jerry Hsu, National Taiwan University of Science and Technology United States S.V. Babu, Clarkson University
    Mahadevaiyer Krishnan, IBM
    Don Frye, Entegris
    Andrew Carswell, Micron

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