ICPT 2018

본문 헤드밑 언더라인


Final Tutorial Program ICPT2018, Seoul
  1. 1. Date: Oct. 14, 2018, 9:00 am to 5:00 pm
  2. 2. Venue: HanKang, Avenue 1F, The K hotel
  3. 3. The CMP community has been grown significantly last 10 years and needs a CMP
    tutorial program which not only updates recent issues in CMP technology but also provides the future direction. The tutorial program is to connect CMP community and to stimulate the ideas and collaboration among endusers, vendors and research institutes. The tutorial program will ever change as the technology and trend change. We invited best possible speakers from all over the world. You will enjoy the content and quality of CMP technology.
  4. 4. Final Program and Speakers
  Time Topic Speaker
  09:00 am - 09:10 am Opening remarks Tutorial chair
1 09:10 am - 10:00 am CMP Technology Overview; past,
present and future
Manabu Tsujimura, Ebara, Japan
  10:00 am - 10:30 am Coffee break  
2 10:30 am - 11:20 am CMP in FEOL and BEOL Patrick Ong, imec, Belgium
3 11:30 am - 12:20 pm CMP equipment and process control technology Seongho Shin, KC Tech, Korea
  12:20 pm - 01:30 pm Lunch  
4 01:30 pm - 02:20 pm CMP consumables; pad, slurry, conditioner and brush JC Yang, SK Hynix, Korea
  02:20 pm - 02:50 pm Coffee break  
5 03:00 pm - 03:50 pm Defects and post CMP cleaning HJ Kim, Global Foundries, USA
6 04:00 pm - 04:50 pm New application of CMP technology; Display and packaging HD Jeong, Pusan National University, Korea
  04:50 pm - 05: 00 pm Concluding remarks Committee chair
  1. 5. Tutorial Fee
    Students : Regular $100,   Late $150
    General : Regular $200,  Late $300
  2. 6. Tutorial fee includes tutorial printouts, pdf files, coffee breaks and lunch box.
    Pdf files will be sent to attendees after the tutorial.
  3. 7. Tutorial Sponsor: Levitronix.

Speaker’s Biography

  • Dr. Manabu Tsujimura is CTO of Ebara Corporation, who has been worked at Ebara Corporation since 1974 until now. From 2011 to 2015 He was Director of the Board, CTO and President of Precision Machinery Company. He is now concentrated to R&D and contribution to academies and associations as CTO. Dr. Tsujimura received a Dr. degree in Engineering field from Tokyo Metropolitan University, Tokyo, Japan. And he is Fellow of JSME (The Japan Society of Mechanical Engineers). For academies, he has contributed to the following universities as Visiting Professor;Clarkson University (USA), Hanyang University (Korea), SKKU(Korea), TaiwanTech (Taiwan), Fudan University (China), Tokyo Metropolitan University 2004-2009(Japan). He is also a committee member of ADMETA (Advanced Metallization Conference). For associations, he has contributed mainly as follows;Chair of SEAJ (Semiconductor Equipment Association of Japan), Vice chair of JVIA (Japan Vacuum Industry Association), Technical advisor of JST (Japan Society and Technology Agency), Committee member of JSPS (Japan Society for the Promotion of Science), He has more than 100 patents, and has written more than 100 papers.
  • Mr. Patrick Ong studied physics at the university of Hamburg, Gemany and received his degree as Diplom Physiker in 2001. In 2001 he joined AMD at Fab30 in Dresden, Germany as a Manufacturing Engineer for Cu CMP. He worked until 2006 for AMD and during that time he was also an assignee for AMD at imec (Leuven, Belgium) and IBM (Fishkill, NY, USA) contributing to different R&D activities for BEOL CMP. In 2006 he joined imec to work on FEOL CMP process development. Currently Patrick Ong is a Senior Process Engineer for CMP at imec, specialized on oxide CMP for STI/FinFet applications, Ge/SiGe CMP and III-V CMP. Since 2012 he is program committee member for ICPT, which is the largest CMP conference in the world. In 2016 he co-authored a chapter for the book Advances in Chemical Mechanical Planarization (CMP). In 2017 he was conference chair of ICPT2017 in Leuven, Belgium. He has authored 18 publications on CMP and co-authored 50 publications.
  • Dr. Sung-Ho Shin received B.S degree from Rensselaer Polytechnic Institute, USA in 1991, M.S. degree from The George Washington University, USA in 1993, and Ph.D. degree from The University of Texas at Austin, USA in 2004, all in Mechanical Engineering. From 1993 to 1999, he was with LG Precision R&D Center, Korea, where he was involved in the joint development of torpedo decoys for submarines and surface vessels with Agency for Defense Development. After his doctoral study he joined Samsung Electronics in 2004, where he developed CMP processes for the success of 20~40 nano Flash and DRAM memory devices at Semiconductor R&D Center, then he led various projects on optimization of semiconductor equipments for improved productivity, reliability and durability at Manufacturing Technology R&D Center of Samsung Electronics. He is now a Managing Director with CMP business division of KC Tech, supervising development of core element technologies for advanced CMP equipments. His technical interests include design, precision engineering, and optimization for the most reliable and convenient devices. He has invented more than 30 patents on CMP processes and equipment designs. He may be reached by email ssh6817@kctech.co.kr.
  • Dr. Ji Chul Yang is Research Fellow at SKhynix Semiconductor in South Korea. Since he joined SKhynix in 2017, he is now responsible for Creative Cleaning&CMP team and is the committee member of innovative executive team in Manufacturing Division. Prior to SKhynix, he was CMP team leader and CMP Representative of Future Technology Roadmap Team at GLOBALFOUNDRIES U.S. He was also engaged in developing 14nm & 7 nm logic CMP process as technical leader. Prior to his time with Globalfoundries, Dr. Yang was CMP Project Leader in Line 16, SAMSUNG Memory Division in South Korea. He has experiences throughout Memory (NAND and DRAM) and Logic Foundries Device over 20 years in semiconductor CMP field. He was invited talker for ICPT2010, ICPT2014, 60th KCMPUGM, ECS2016, SEMICONWEST-CMP2016, STS2017. Dr. Yang has a Ph.D degree in Electronics Engineering from SUNGKYUNKWAN University, South Korea, Master’s degree in Mechanical Engineering from YONSEI University, South Korea and Bachelor’s degree from Inha university. He has authored more than 40 technical publications and conference presentations with semiconductor items. He may be reached at 82-10-8643-5546 or by email jichul.yang@sk.com.
  • Dr. Hong Jin Kim received B.S degree from Korea University in 1999, M.S. from Korea Advanced Institute of Science and Technology (KAIST) in 2001, and Ph.D. in materials science and engineering from The Ohio State University in 2007, respectively. From 2007 to 2013, he had worked at Samsung Electronics Semiconductor R&D center for the advanced memory device development. His major research has focused on materials aspect of tribology, interfacial behavior of materials, computational materials science and engineering, semiconductor processing, wet cleaning and chemical mechanical polishing. He has wide and in-depth experiences on FEOL/MOL CMP process development, CMP consumables engineering, fundamentals of CMP, post CMP cleaning, and defect engineering in semiconductor processing. He published 1 book chapter and 46 papers. He did more than 70 conferences presentations as author/co-authored, and holds 9 patents. His papers are featured at Advances In Engineering, ADINA news, and Tribology and Lubrication Technology. He also has served as editorial board member in several journals (JNNA, AMPC, MME, KSTLE) and technical committee member in international conferences (ADMETA, IFToMM, ICAMM, HKASE). Dr. Hong Jin Kim is currently working at GLOBALFOUNDRIES as Senior Member of Technical Staff (SMTS).
  • Professor Haedo Jeong received B.S. degree from Pusan National University, Korea in 1987 and the M.S. degree and Ph.D. in mechanical engineering from KAIST, Korea in 1989 and from University of Tokyo, Japan in 1994, respectively. From 1989 to 1991, he worked at government research institutes of KIST and KITECH, where he was responsible for abrasive machining process such as grinding and polishing. In 1994, he joined at Japanese government project with RIKEN and Fujikoshi machinery, Japan as a post-doc. researcher to develop a CMP equipment. From 1995, he is working as a professor in the school of mechanical engineering as well as a director of CMP Lab at Pusan National University. He has also served as a director of LINC (Leaders in INdustry-university Cooperation) project. His research interests include wafering processes, chemical mechanical polishing and its post cleaning. He has authored more than 600 technical publications/presentations in the area of abrasive processing, 3D printing and CMP. He is the past president of Korea CMPUGM and an executive committee member of International Conference on Planarization/CMP Technology (ICPT) which is the largest CMP conference in the world. He is also a founder and president of G&P Technology which is one of the strongest semi-production CMP tool suppliers and expands its area to packaging and display. He is also a vice-president of Korean Society of Precision Engineering (KSPE). Thanks to his contribution, he got many awards and medals from 30 different organizations including government. He may be reached at 82-51-510-2463 or by email hdjeong@pusan.ac.kr.

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