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50th T/M Yeongbong Park_Pusan Nat. Univ._Design Considerations for Controlling Wafer Edge
작성자 CMPUGM 작성일 2012-05-29 조회수 1076
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Yeongbong Park_Pusan Nat. Univ._Design Considerations for Controlling Wafer Edge

작성자
비밀번호
이전글   57th 2-1. Jin-Goo Park_Challenges in 1x Design Node Semiconductor Device Cleaning
다음글   57th 2-4. Soo-Bum Kim_Effect of Secondary Abrasive Size Distributions
리스트
게시물 수 : 111
번호 제목 작성자 작성일 조회수
11 7~9th materials   CMPUGM 70.01.01 949
10 Automation for 300mm wafer-CMPUGM.ppt   CMPUGM 70.01.01 956
9 2001 CMPMIC review 2   CMPUGM 70.01.01 963
8 2001 CMP-MIC Review   CMPUGM 70.01.01 1,026
7 Cu CMP Using Abrasive-Free Slurry   CMPUGM 70.01.01 893
6 Damascene Metal gate formation by noble CMP   CMPUGM 70.01.01 786
5 Post STI and W CMP Cleaning Challenges: Single Wafer and Batch Megasonics Solutions   CMPUGM 70.01.01 990
4 Large Particle Formation in CMP Slurries: Fundamentals, Metrology, and Control Strategies   CMPUGM 70.01.01 869
3 Rotary Bonded Abrasive Planarization   CMPUGM 70.01.01 743
2 IN-SITU ENDPOINT AND PROCESS CONTROL FOR CMP PROCESSING   CMPUGM 70.01.01 872
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